Product Summary
The ADG702BRM-REEL is a monolithic CMOS SPST switche. The switches is designed on an advanced submicron process that provides low power dissipation yet high switching speed, low on resistance, and low leakage current. In addition, −3 dB bandwidths of greater than 200 MHz can be achieved. Applications are (1)Battery-powered systems; (2)Communications systems; (3)Sample-and-hold systems; (4)Audio signal routing; (5)Video switching; (6)Mechanical reed relay replacement.
Parametrics
ADG702BRM-REEL absolute maximum ratings: (1)VDD to GND: −0.3 V to +7 V; (2)Analog and Digital Inputs1: −0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first; (3)Continuous Current, S or D: 30 mA; (4)Peak Current, S or D: 100 mA, pulsed at 1 ms, 10% duty cycle maximum; (5)Operating Temperature Range Industrial (B Version): −40°C to +85°C; (6)Storage Temperature Range: −65°C to +150°C; (7)Junction Temperature: 150°C; (8)MSOP Package, Power Dissipation: 315 mW; (9)θJA Thermal Impedance: 206°C/W; (10)θJC Thermal Impedance: 44°C/W; (11)SOT-23 Package, Power Dissipation: 282 mW; (12)θJA Thermal Impedance: 229.6°C/W; (13)θJC Thermal Impedance: 91.99°C/W; (14)Lead Temperature, Soldering Vapor Phase (60 sec): 215°C; (15)Infrared (15 sec): 220°C; (16)Pb-free Reflow Soldering Peak Temperature: 260(+0/−5)°C; (17)Time at Peak Temperature: 10 sec to 40 sec; (18)ESD: 2 kV.
Features
ADG702BRM-REEL features: (1)1.8 V to 5.5 V single supply; (2)2 Ω (typical)on resistance; (3)Low on resistance flatness; (4)-3 dB bandwidth > 200 MHz; (5)Rail-to-rail operation; (6)Fast switching times: tON 18 ns; tOFF 12 ns; (7)Typical power consumption < 0.01 μW; (8)TTL/CMOS-compatible .
Diagrams
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![]() ADG702BRM-REEL |
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![]() IC SWITCH SPST 8MSOP |
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![]() ADG702BRM-REEL7 |
![]() Analog Devices Inc |
![]() IC SW 1.8/5.5V SPST 2-OHM 8MSOP |
![]() Data Sheet |
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