(China (Mainland))
Product Summary
The XC3090TM-7 is a member of the Logic Cell Array family. It has a proven track record in addressing a wide range of design applications, including general logic replacement and sub-systems integration. For a thorough description of the XC3090TM-7 architecture see the preceding pages of this data book. It covers a range of nominal device densities from 2,000 to 9,000 gates, practically achievable densities from 1,000 to 6,000 gates. Device speeds, described in terms of maximum guaranteed toggle frequencies, range from 70 to 125 MHz. The performance of a completed design depends upon placement and routing implementation, so, like with any gate array, the final verification of device utilization and performance can only be known after the design has been placed and routed.
Parametrics
XC3090TM-7 absolute maximum ratings: (1)VCC Supply voltage relative to GND: –0.5 to +7.0 V; (2)VIN Input voltage with respect to GND: –0.5 to VCC +0.5 V; (3)VTS Voltage applied to 3-state output: –0.5 to VCC +0.5 V; (4)TSTG Storage temperature (ambient): –65 to +150 ℃; (5)TSOL Maximum soldering temperature (10 s @ 1/16 in.): +260℃ ; (6)TJ Junction temperature plastic: +125 ℃; (7)TJ Junction temperature ceramic: +150 ℃.
Features
XC3090TM-7 features: (1)Industry-leading FPGA family with five device types: Logic densities from 1,000 to 6,000 gates, Up to 144 user-definable I/Os; (2)Guaranteed 70- to 125-MHz toggle rates, 9 to 5.5 ns logic delays; (3)advanced CMOS static memory technology: Low quiescent and active power consumption; (4)Ultra-low current option in Power-Down mode; (5)4-mA output sink and source current; (6)Broad range of package options includes plastic and ceramic quad flat packs, plastic leaded chip carriers and pin grid arrays; (7)100% bitstream compatible with the XC3100 family; (8)Commercial, industrial, military, “high rel”, and MILSTD-883 Class B grade devices; (9)Easy migration to XC3300 series of HardWire mask-programmed devices for high-volume production.
Diagrams
